All CFPs for "advanced packaging and heterogeneous integration"
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Acronym | Name | Location | Submission deadline | Start date | Topics | Add to watchlist |
|---|---|---|---|---|---|---|
| PAINE 2026 | IEEE International Conference on Physical Assurance and Inspection of Electronics | Phoenix, AZ, United States | Jul 20, 2026 | Oct 27, 2026 | characterization and assurance advanced packaging and heterogeneous integration physical inspection image analysis and artificial intelligence | |